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IC封装资料_电源管理芯片_AN431AN-ATRG1.pdf
AN431Documentnumber:DS37414Rev.3-21of13www.diodes.comApril2015©DiodesIncorporatedAN431AProductLineofDiodesIncorporatedADJUSTABLEP...
2024-12-12609437.66 KB13页100
IC封装资料_电感_LQP15MN4N7B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-12608245 KB9页179
IC封装资料_连接器_1715734.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1260836.13 MB445页299
IC封装资料_电源管理芯片_LTC4411ES5_TRMPBF.pdf
LTC441114411faLTC4411SCHOTTKYDIODECONSTANTIONCONSTANTRONCONSTANTVONVFWDFORWARDVOLTAGE(V)LTC4411FO1bSLOPE1/RONSLOPE1/RFWDIOCIMAXIFW...
2024-12-12608235.84 KB8页202
IC封装资料_电容_0603B103K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126081.05 MB27页25
IC封装资料_电容_TAJE686M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12608210.31 KB7页30
IC封装资料_电容_1206B225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126081.05 MB27页169
IC封装资料_电容_JMK212BJ106KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12607653.27 KB26页3
IC封装资料_电源管理芯片_LTC3859IUHF_TRPBF.pdf
LTC385913859fbTypicalapplicaTionDescripTionLowIQ,TripleOutput,Buck/Buck/BoostSynchronousControllerTheLTC®3859isahighperformancetr...
2024-12-12607631.38 KB42页78
IC封装资料_电感_SWPA5040S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126061.32 MB22页46
IC封装资料_电容_0603B183K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126061.26 MB20页162
IC封装资料_电容_0402B102K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126061.26 MB20页63
IC封装资料_电感_LQG15HS4N7S02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12606357.65 KB11页5
IC封装资料_三极管_AO3402.pdf
N-ChannelEnhancementModeMOSFETFeature30V/4.2ARDS(ON)=50mΩ(MAX)@VGS=10V.RDS(ON)=60mΩ(MAX)@VGS=4.5V.SuperHighdensecelldesignforext...
2024-12-126061.1 MB4页256
IC封装资料_电容_EVK105CH1R5BW-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12605653.27 KB26页96
IC封装资料_电容_CL10B392KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12605259.58 KB3页92
IC封装资料_电源管理芯片_RS3002-5_0YE3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-12605660.04 KB15页277
IC封装资料_电容_CL03C0R6CA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-126057.46 MB84页172
IC封装资料_电容_0603F333Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126051.26 MB20页133
IC封装资料_电容_CC1206KRX7RABB561.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12605998.46 KB11页198

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