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IC封装资料_电源管理芯片_LT3652EMSE_PBF.pdf
LT365213652feFormoreinformationwww.linear.com/LT3652TYPICALAPPLICATIONDESCRIPTIONPowerTracking2ABatteryChargerforSolarPowerTheLT®...
2024-12-12605600.17 KB26页112
IC封装资料_连接器_1755574.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/8-GOrderNo.:1755574...
2024-12-12605230.32 KB5页175
IC封装资料_电感_LQG15HS1N6S02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12604359.54 KB11页191
IC封装资料_电容_AC0603JRNPO9BN100.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126041.06 MB24页36
IC封装资料_电容_T491D477K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126041.54 MB23页242
IC封装资料_电容_CL10C0R5CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12604340.11 KB3页61
IC封装资料_电容_CL21B104KACNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126041.45 MB36页273
IC封装资料_电容_CC0201JRNPO8BN330.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126041.22 MB13页241
IC封装资料_电容_CL03C1R5CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-126041.4 MB36页86
IC封装资料_电容_CC1206JRNPO9BN220.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126041.22 MB13页112
IC封装资料_电容_GRM188R71H683KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12603944.07 KB30页49
IC封装资料_电容_AC0603KRX7R9BB223.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126021.81 MB24页262
IC封装资料_电容_CL10B563KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12602259.58 KB3页212
IC封装资料_电容_0402X104M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126021.05 MB27页156
IC封装资料_电容_CC0201JRNPO9BN560.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126021.22 MB13页228
IC封装资料_连接器_1.25T-2A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12602273.91 KB1页30
IC封装资料_电容_C3225X7R1C106KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-126021.61 MB56页188
IC封装资料_电源管理芯片_LT3010EMS8E-5_PBF.pdf
LT3010/LT3010-5130105feFEATURESAPPLICATIONSDESCRIPTION50mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3010isahighvoltage,mic...
2024-12-12602488.53 KB18页130
IC封装资料_电感_NLV25T-8R2J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12602215.06 KB9页228
IC封装资料_电源管理芯片_RT9013-33GB.pdf
RT90131DS9013-10April2011www.richtek.comPinConfigurationsApplications�CDMA/GSMCellularHandsets�PortableInformationAppliances�La...
2024-12-12601384.76 KB13页26

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